Contact number：+86-0379-60853300
Company fax：+86-0379-64152661
Postcode：471000
Email：info@yuxindiamond.com
Address：3-1-508 Luoyang National University Science Park, No. 2 Penglai Road, Jianxi District, Luoyang, China 471000
Chemical Vapor Deposition (CVD) diamond film is made by Chemical Vapor Deposition process. The thermal conductivity of the diamond at room temperature can be up to 22 W/(cm·k), which is 5 times of the thermal conductivity of copper, 6 times of the thermal conductivity of aluminum nitride, and more than 7 times of the beryllium oxide. It can transmit heat generated by electronic devices. Furthermore, the diamond is a typical insulator due to its resistivity is as high as 1016Ω. Therefore, the diamond is the most ideal material for thermal sink.
It mainly applies to the array of high-power diode, high-power light emitting diode (LED), radio frequency power transistor, high-power & high-frequency electronic (optoelectronic) devices, the cooling fin of multichip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.
Performance parameters | |
Vickers hardness | 8000kg/mm2-1000kg/mm2 |
Density | 3.52cm³ |
Young modulus | 850GPa |
Thermal conductivity | 1200W/mk--2000W/mk |
Chemical stability | Non-soluble in all kinds of acid and alkali |
Breaking strength | 350Mpa |
Coefficient of thermal expansion | 1.0+/-0.1ppm/K(300K) 4.4+/-0.1ppm/K(1000K) |
Poisson's ratio | 0.1 |
Parallelism | ＜4＜µ/cm |
Thickness tolerance | +/-50µm |
Roughness of growth surface | ＜100nm Ra |
Roughness of nucleation surface | ＜30nm Ra |
Standard thickness | 300µm |
Available sizes:
Thickness of thick film:0.3-1.5mm
Degree after polishing:0.2-1.0mm
Main heat sink materials and performances | ||||
Material | Electrical properties | Thermal conductivity/【W/(m.K)】 | Coefficient of thermal expansion/(10-6K-1) | Density /(g/cm3) |
Diamond | Insulator | 2000 | 0.8-1.0 | 3.52 |
AL | Conductor | 247 | 23 | 22.7 |
SiC/Al | Conductor | 170-220 | 6.2-7.3 | 3.0 |
B/Al | Conductor | 145 | 13-15 | 22.7 |
Diamond/Al | Conductor | 375-670 | 5.07-12.5 | <3.5 |
Cu | Conductor | 398 | 17 | 8.9 |
Cu/Mo | Conductor | 170-210 | 5.7-6.0 | 9.4-10.01 |
Cu/W | Conductor | 150-205 | 6.5-8.3 | 15.7-17.6 |
Graphite/Cu | Conductor | 400 | 2.8-3.5 | 5.3 |
Diamond/Cu | Conductor | 400-600 | 6.0-6.5 | 5.0-5.5 |
Au | Conductor | 315 | 14 | 19.32 |
Mo | Conductor | 142 | 4.9 | 10.22 |
[W] | Conductor | 155 | 4.5 | 19.3 |
BeO | Insulator | 260 | 6 | 3 |
AlN | Insulator | 320 | 4.5 | 3.3 |
SiC | Insulator | 270 | 3.7 | 3.3 |
Special sizes can be customized.
Contact number：+86-0379-60853300 Company fax：+86-0379-64152661
Postcode：471000 Email：info@yuxindiamond.com
Address：3-1-508 Luoyang National University Science Park, No. 2 Penglai Road, Jianxi District, Luoyang, China 471000
Copyright：Luoyang Yuxin diamond Co., Ltd.
