Electronic products tend to miniaturization while its power is growing, thermal management becomes more difficult in the result that the semiconductor components power density continues to increase, heat flux will be more and more, and some even reach the heat flux is 5 times of the sun surface. If so much heat wasn’t timely derived from the components of the divergence, which will be a serious threat to the stability of electronic products, the resulting heat problems become the key issues in microelectronics packaging technology. And studies have shown that half of the electronic devices’ malfunction are caused by heat-related problems.

With increasing requirements of the end product to be light and efficient, to enhance performance is not only the development direction of the semiconductor program, heat dissipation performance has become a very important factor in semiconductor design. In the face of the limitations of traditional packaging materials, more and more new heat dissipation materials have been created, with low thermal expansion, high thermal conductivity, and very light quality. CVD diamond film as the representative of the above materials, the thermal conductivity can be up to 2000W/(m.K), but also has excellent mechanical, optical, electrical, acoustic and chemical properties, compared to natural diamond, CVD diamond has the same structure and properties, especially with low cost. So that the advantages of application on high-power optoelectronic devices’ heat dissipation are significantly higher than other materials. At present, CVD diamond has been applied in thermal management both at home and abroad, mainly to solve the problem of system heat dissipation caused by high power and high heat density components, including high power laser diode array, three-dimensional multi-chip assembly (MCM) and solid-state microwave power device cooling applications.

CVD diamond radiator has been proven to be able to effectively reduce the overall package thermal resistance, far better than other common materials. Diamond with the "carbon quality" feature is really great, including the highest known thermal conductivity, hardness as well as in the longer wavelength range with high optical transmission characteristics, low expansion coefficient and low density properties. CVD diamond also has a completely isotropic characteristics, to strengthen the heat diffusion in all directions. These properties make the diamond a thermal management application material that can significantly reduce thermal resistance.

The application of CVD diamond can significantly improve the thermal management of electronic systems. Diamond radiator can directly replace aluminum nitride, beryllium oxide or other high-grade ceramic, and the integration is relatively straightforward. With the improvement of synthetic technology, the development of processing technology and the continuous reduction of cost, CVD diamond has become a more attractive radiator, and is increasingly widely used in various fields. And according to the latest report of People's Network, the new material industry is China's one of the top ten most promising industries in 10 years.

Luoyang Yuxin Diamond Co., Ltd preparing CVD diamond heat sink, which is made by Chemical Vapor Deposition process. The thermal conductivity of the diamond at room temperature can be up to 22 W/(cm·k), it can transmit heat generated by electronic devices. Furthermore, the diamond is a typical insulator due to its resistivity is as high as 1016 Ω. Therefore, the diamond is the most ideal material for thermal sink. 

It mainly applies to the array of high-power diode, high-power light emitting diode (LED), radio frequency power transistor, high-power & high-frequency electronic (optoelectronic) devices, the cooling fin of multichip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.

Available sizes:

Thickness of thick film:0.3-1.5mm

Degree after polishing:0.2-1.0mm

Special size can be produced according to customer requirements.