NO.1 The thermal properties of diamond films

Diamond has the highest thermal conductivity at room temperature, is 5 times of the thermal conductivity of copper, 6 times of the thermal conductivity of aluminum nitride and over 7 times of beryllium oxide, the thermal expansion coefficient is also very small. Heat dissipation is especially significant at high temperature. The resistivity of diamond is up to 1016Ω, a typical insulator. And the diamond has excellent chemical inertness, the ability to withstand various temperatures of nonoxidizing acid. Diamond has all the essential features as heat sink materials. So diamond is the ideal heat sink material.

NO.2 Widely used in the field of heat

The ideal heat dissipation materia for a high power laser devices, microwave devices, electronic devices and other electronic devicesl. Meanwhile, can be applied to a variety of high power windows, such as high power CO2 laser window, high power microwave window, these applications provide a good condition for the research and development of high-power laser weapons and high-power microwave weapons. In the optical communication, semiconductor diode lasers, laser diodes, power transistors, electronic packaging materials, etc., the original heat sink of the diamond film material has been applied. Can also be used as MCMs (multi-chip three-dimensional integration) and other products of the heat sink. In addition, the diamond film as a base of a variety of high-frequency, high power field effect transistor, have excellent prospects in the satellite communications, signal transmission stations and high-resolution radar and other fields. And the semiconductor chip diamond package is also a great application areas with a very large market potential.

NO.3 Our products - CVD industrial synthetic diamond film used in thermal sink

Chemical Vapor Deposition (CVD) diamond film is made by Chemical Vapor Deposition process. The thermal conductivity of the diamond at room temperature can be up to 22 W/(cm·k), it can transmit heat generated by electronic devices. Furthermore, the diamond is a typical insulator due to its resistivity is as high as 1016 Ω. Therefore, the diamond is the most ideal material for thermal sink.

It mainly applies to the array of high-power diode, high-power light emitting diode (LED), radio frequency power transistor, high-power & high-frequency electronic (optoelectronic) devices, the cooling fin of multichip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.

Available sizes:

Ø Thickness of thick film:0.3-1.5mm

Ø Degree after polishing:0.2-1.0mm

Ø Special size can be produced according to customer requirements

NO.4 The advantages of our products

The largest size

According to customer requirements, easier processing

High thermal conductivity

Longer lifespan