The thermal conductivity of the diamond at room temperature can be up to 22 W/(cm·k), which is 3-5 times of the thermal conductivity of copper, and 6 times the thermal conductivity of aluminum nitride. . It can transmit heat generated by electronic devices. Furthermore, the diamond is a typical insulator due to its high resistivity. Therefore, the diamond is the most ideal material for thermal sink.

Optical Communications: The emergence of large-area high thermal conductivity CVD diamond films has enabled thermal management applications in high-power laser diode arrays (LDA) and other microelectronic and optoelectronic devices. The highest thermal conductivity level of diamond has reached 2200w/m.k.

Chip heat dissipation: Another more attractive application prospect of diamond heat sink is the multi-chip assembly technology under development. The goal of this technology is to closely arrange and combine many VLSI chips in a three-dimensional Small ultra-high performance devices, and the heat dissipation of these chips is the key to this technology, and diamond film is the most ideal material to solve this technical problem.

New energy vehicles: Diamond is a direct competitor of silicon carbide. Unlike silicon carbide, which has an upper limit of 200°C (392°F), diamond can operate above 500°C. Many of the similar challenges faced in military aerospace applications, such as high temperatures, apply to the automotive industry, where the overall heat loss from the engine must be reduced.

5G base station: At present, the average power consumption of a single tenant of a 5G outdoor base station is about 3.8KW, which is more than three times that of a 4G base station. The cost of electricity may overdraw all the profits of operators. The 5G market is about to increase in volume. Diamond is used as a thermal management material for 5G base stations. By giving full play to the excellent heat dissipation performance of diamond, it will greatly save electricity and truly realize green, environmental protection and low carbon.

Military aerospace: Gallium nitride GaN is accelerating the exploration of aerospace applications, and the combination of gallium nitride and diamond will achieve a leap in performance. 

High-power electronic devices: Diamond heat sinks can effectively solve heat dissipation problems and improve the performance of power devices of the same size. The size of diamond heat sinks is no longer limited to single devices or small arrays; array sizes can be extended to several centimeters. It is widely used in various devices. When used in a phased array chip, it can significantly improve the reliability of the system and reduce the size and cost of the system; when used in a solid-state power amplifier, it can significantly reduce the size, cost and quality of the device and improve efficiency; for broadband When communicating, reliability can be improved while reducing chip size and cost.

CVD polycrystalline diamond is cheaper than single crystal diamond, and has high thermal conductivity and low surface roughness. It is easy to introduce into the structure of semiconductor power devices, significantly improves the heat dissipation capacity of the device, and has a wider application field.

Yuxin diamond offers CVD(Chemical Vapor Deposition) diamond with thermal conductivity in the range of 800~1800 W/m.k.